Home [4] Characterization of the crystallographic microstructure of the stress-induced void in Cu interconnects
저자
H.-J. Lee, H. N. Han, J.-H. Kim, S. H. Kang, Y.-G. Cho, J.-Y. Sun, D. H. Kim and K. H. Oh
저널 정보
Applied Physics Letters
출간연도
2008
링크
https://pubs.aip.org/aip/apl/article/92/14/141917/166095/Characterization-of-the-crystallographic
